CALL FOR PAPER ABSTRACTS

February 1, 2004

Dear CESASC, CAST-LA, and VACETS Members and Friends:

The Chinese-American Engineers and Scientists Association of Southern California (CESASC), in association with The Chinese Association for Science and Technology California Chapter at Los Angeles (CAST-LA), and The Vietnamese Association for Computing, Engineering Technology and Science (VACETS), is pleased to invite you to submit abstracts of your papers for the 2004 Technical Symposium.

The 2004 Technical Symposium, with a theme of "New Waves in Technology," will be held from 9:00am to 5:00pm on May 22, 2004 (Saturday) at the Los Angeles Airport Hilton & Towers.  Tentatively, we plan to have 2 keynote speeches, 1 special forum, 4 paper presentation sessions, and 2 panel discussion sessions.

The topic for the special forum is "Impacts of Technology Developments on Economy Growth in Pacific Rim."

The topics for the 4 paper presentation sessions are

(1) Information Technology (Computer, Wireless, and Networking)

(2) Bio-technology

(3) Aeronautics and Astronautics

(4) Social Sciences and Humanities

The topics for the 2 panel sessions are:

(1) Overview of Nano-technology and its Applications

(2) Managing High-Tech Start-Up Company for its Success

Please submit your paper abstracts before April 1, 2004, via e-mail, to one of the following people:

Dr. Liping Yan, E-mail: lipingyan@earthlink.net

Dr. Yutao He (Editor of Proceedings), E-mail: yutao@cs.ucla.edu

Dr. Nhan T. Do, E-mail: ndo@sst.com

The abstract must be written in English with a maximum of 500 words. A brief vita of yourself should be included along with your submittal.

The Technical Committee will notify you no later than April 22, 2004 on the acceptance of your submission. All accepted paper abstracts will be published in the symposium proceedings.

Please also note that we will post and update all symposium related information on the following website sites:

http://www.cesasc.org, | http://www.cast-la.org, | http://www.vacets.org

Thank you for your participation.

Technical Committee for the 2004 Technical Symposium